Intel shows off a 10nm wafer and a bevy of other developments on the occasion of Technology and Manufacturing Day

[Redaktion]

At its Technology and Manufacturing Day held in Beijing, Intel showcased a number of new developments ranging from the 10nm process for its upcoming 'Cannon Lake' chips to the first commercially available 64-layer 3D NAND for data centers. The company also shared plans for its first 10nm FPGA codenamed 'Falcon Mesa'.

https://www.notebookcheck.net/Intel-shows-off-a-10nm-wafer-and-a-bevy-of-other-developments-on-the-occasion-of-Technology-and-Manufacturing-Day.249542.0.html