3D chips: Smartphones might make a big leap in performance as MIT researchers unveil new tech

[Redaktion]

In a breakthrough that could pave the way for faster, more powerful, and longer-lasting electronics, researchers at MIT have developed a new, low-cost process for building 3D chips. This method, detailed in a report from MIT News on June 18, 2025 integrates high-performance GaN transistors onto standard silicon chips, leading to higher performance.

https://www.notebookcheck.net/3D-chips-Smartphones-might-make-a-big-leap-in-performance-as-MIT-researchers-unveil-new-tech.1040194.0.html