Intel announces glass substrate packaging for future processors, aims for 1 trillion transistors per chip by 2030

[Redaktion]

Intel's glass substrate technology for next-generation advanced packaging is planned to make its debut in the second half of this decade. The breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore's Law to deliver faster AI, HPC and graphics applications.

https://www.notebookcheck.net/Intel-announces-glass-substrate-packaging-for-future-processors-aims-for-1-trillion-transistors-per-chip-by-2030.752617.0.html