Intel officially announces Lakefield SKUs based on Foveros, pits them against Amber Lake-Y

[Redaktion]

Intel has finally detailed the Lakefield family of processors based on the Foveros 3D packaging tech. The current Lakefield lineup includes the Core i3-L13G4 and the Core i5-L16G7, which are 7 W penta-core parts featuring a 10nm Sunny Cove and four 10nm Tremont cores. Intel Lakefield is available in the Samsung Galaxy Book S and the upcoming Lenovo ThinkPad X1 Fold and the Microsoft Surface Neo.

https://www.notebookcheck.net/Intel-officially-announces-Lakefield-SKUs-based-on-Foveros-pits-them-against-Amber-Lake-Y.469562.0.html