In a breakthrough that could pave the way for faster, more powerful, and longer-lasting electronics, researchers at MIT have developed a new, low-cost process for building 3D chips. This method, detailed in a report from MIT News on June 18, 2025 integrates high-performance GaN transistors onto standard silicon chips, leading to higher performance.
Deutsch
English
Español
Français
Italiano
Nederlands
Polski
Português
Русский
Türkçe
Svenska
Chinese
Magyar