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Global Foundries and ARM working on high-density 3D chips

Started by Redaktion, August 09, 2019, 15:14:05

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Unable to make the jump to 7 nm for the time being, Global Foundries is looking to expand the life span and scalability of its current 12 nm node with 3D stacking manufacturing techniques. The company is now collaborating with ARM in order to deliver 12 nm FinFET chips with higher core counts and lower latency between cores.


Their 12nm is on par in density with...Intel's 22nm? Is that efficiency acceptable in mass scale application of CPUs?

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