Kirin 9030 Pro teardown reveals China's new playbook for advanced chipmaking

[Redaktion]

A SemiAnalysis teardown of Huawei's Kirin 9030 Pro suggests SMIC's DUV-only N+3 process rivals Intel's 18A node in one unexpected area despite lacking access to EUV lithography. The report explores the engineering tricks that made it possible and why they still fall short of matching the industry's leading-edge processes.

https://www.notebookcheck.net/Kirin-9030-Pro-teardown-reveals-China-s-new-playbook-for-advanced-chipmaking.1347876.0.html