SK hynix reportedly merges DRAM and NAND into unified High-Bandwidth Storage package to boost on-device AI performance

[Redaktion]

SK hynix is reportedly developing a new High-Bandwidth Storage (HBS) package that merges DRAM and NAND chips into one ultra-efficient module. The innovation promises faster data processing, better heat control, and enhanced AI performance for next-generation smartphones and tablets.

https://www.notebookcheck.net/SK-hynix-reportedly-merges-DRAM-and-NAND-into-unified-High-Bandwidth-Storage-package-to-boost-on-device-AI-performance.1161216.0.html