AMD patent details HB-DIMM RAM implementation that doubles current DDR5 bandwidth for consumer PCs

[Redaktion]

Team Red's HB-DIMM standard is designed to effectively double the current DDR5 bandwidth by reaching 12.8 Gbps transfer speeds, but without radically changing the design in order to ensure compatibility with current consumer and server-grade systems.

https://www.notebookcheck.net/AMD-patent-details-HB-DIMM-RAM-implementation-that-doubles-current-DDR5-bandwidth-for-consumer-PCs.1130789.0.html

[Enma45]

I think I have it all figured out: my next laptop will definitely be an AMD one, without a doubt. Given that Intel has disappointed me with their laptops over the last 4 years, my choice will be the MEDUSA HALO, the upcoming processor with AMD ZEN 6 architecture.

[A]

SOCAMM2 currently sees more industry support, so AMD's HB-DIMM might have a hard time receiving adoption at least when it comes to HPC and server sectors.

Why? SOCAMM2 is aimed at laptops to save space, for servers it isn't that big of a deal, 1U isn't going to change in size. HB-DIMM is more aimed at AI workload on the side, so it would work perfect for low end servers who might do some AI work without paying the huge HBM3 cost.

[Bogdan Solca]

Why? SOCAMM2 is aimed at laptops to save space, for servers it isn't that big of a deal, 1U isn't going to change in size. HB-DIMM is more aimed at AI workload on the side, so it would work perfect for low end servers who might do some AI work without paying the huge HBM3 cost.

I think you're confusing SOCAMM with LPCAMM. SOCAMM (Small Outline Compression Attached Memory Module) is a next-generation compression attached memory module standard proposed by NVIDIA, specifically designed for high-performance computing platforms such as AI servers (e.g., GB300), edge computing, and embedded systems.

[A]

I think you're confusing SOCAMM with LPCAMM. SOCAMM (Small Outline Compression Attached Memory Module) is a next-generation compression attached memory module standard proposed by NVIDIA, specifically designed for high-performance computing platforms such as AI servers (e.g., GB300), edge computing, and embedded systems.

Okay, I see, you are right. Didn't know about that one as it got overshadowed by LPCAMM, both are designed by Dell too.

That said, SOCAMM seems to be a cooperation between Dell and Intel.

If AMD decides to use HB-DIMM for their server chipsets? Then that effectively becomes what is used.

For companies like Micron, Samsung, or even Dell they have to convince the industry but for Intel and AMD, whatever they set is what gets used.