Deposition breakthrough enables the development of 120-layer high-density 3D DRAM

[Redaktion]

imec and Ghent University have demonstrated 120 alternating silicon and silicon-germanium layers on 300mm wafers, a key step toward horizontally stacked 3D DRAM.

https://www.notebookcheck.net/Deposition-breakthrough-enables-the-development-of-120-layer-high-density-3D-DRAM.1096180.0.html