These new JEDEC e-MMC 5.1-compliant embedded NAND flash memory chips will enter mass production in a few months and target a wide range of digital consumer products.
http://www.notebookcheck.net/Toshiba-announces-new-eMMC-5-1-embedded-memory-modules.139149.0.html
http://pc.watch.impress.co.jp/docs/news/20150326_694721.html
Toshiba has already announced their 48-layer technical 3D-transistor 2-bit cell (MLC) flash module, with larger capacity, faster writing speed, and enhanced reliability to the rewriting life, achieved a 16GB capacity on a single chip.
This is fully unlike Samsung's TLC module, TLC is a low technical chip and the worse rewriting life.
Why do I get the feeling they won't release them worldwide for a while? They definitely look impressive, nevertheless.
Toshiba is starting the BiCS sample shipments of the new product today.
Toshiba is readying Fab2 at Yokkaichi Operations in Mie prefecture, Japan for BiCS mass production. Clean rooms are being built in phases, and construction will be complete in the first half of 2016.
http://www.tomshardware.com/news/toshiba-bics-nand-3d,28830.html
http://www.anandtech.com/show/9113/toshiba-announces-48layer-128gbit-3d-nand