English => News => Topic started by: Redaktion on November 17, 2025, 09:33:32
Title: Intel can challenge TSMC’s dominance as Apple and Qualcomm eye EMIB and Foveros packaging for next-gen chips
Post by: Redaktion on November 17, 2025, 09:33:32
Intel's EMIB and Foveros advanced packaging technologies are starting to attract attention from Apple and Qualcomm. The growing interest could be Intel's chance to challenge TSMC's dominance in next-generation chip manufacturing.