English => News => Topic started by: Redaktion on November 12, 2025, 13:06:17
Title: SK hynix reportedly merges DRAM and NAND into unified High-Bandwidth Storage package to boost on-device AI performance
Post by: Redaktion on November 12, 2025, 13:06:17
SK hynix is reportedly developing a new High-Bandwidth Storage (HBS) package that merges DRAM and NAND chips into one ultra-efficient module. The innovation promises faster data processing, better heat control, and enhanced AI performance for next-generation smartphones and tablets.