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English => News => Topic started by: Redaktion on May 17, 2025, 00:36:46
TSMC will open nine advanced plants and a CoWoS packaging line in 2025 backed by a record $38–42 billion capex. The expansion spans Taiwan, Arizona, Japan and Germany, driven by surging demand for high-performance computing and AI packaginghttps://www.notebookcheck.net/TSMC-plans-nine-2nm-fabs-and-record-38-42-billion-capex-in-2025.1018499.0.html