English => News => Topic started by: Redaktion on August 08, 2024, 00:21:15
Title: UCIe 2.0: Advancing the open chiplet ecosystem with 3D packaging and manageability
Post by: Redaktion on August 08, 2024, 00:21:15
The UCIe Consortium has released UCIe 2.0, introducing key enhancements to the Universal Chiplet Interconnect Express specification. The new version adds support for standardized manageability, testability, and 3D packaging, further advancing the chipset ecosystem.