NotebookCHECK - Notebook Forum
English => News => Topic started by: Redaktion on December 05, 2023, 18:00:04
Industry sources close to The Elec claim that Samsung is acquiring packaging equipment from Japanese company Shinkawa in order to produce HBM3 RAM and interposers for the upcoming Blackwell AI accelerators. TSMC is still producing the GPU chips, however.https://www.notebookcheck.net/Samsung-may-produce-key-components-for-Nvidia-s-Blackwell-AI-accelerators-on-SAINT-packaging-tech.778918.0.html