English => News => Topic started by: Redaktion on September 19, 2023, 18:23:35
Title: Intel announces glass substrate packaging for future processors, aims for 1 trillion transistors per chip by 2030
Post by: Redaktion on September 19, 2023, 18:23:35
Intel's glass substrate technology for next-generation advanced packaging is planned to make its debut in the second half of this decade. The breakthrough achievement will enable the continued scaling of transistors in a package and advance Moore's Law to deliver faster AI, HPC and graphics applications.