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English => News => Topic started by: Redaktion on January 05, 2023, 16:35:30

Title: AMD introduces Instinct MI300 exascale APU combining Zen 4 EPYC cores with CDNA 3 GPGPU cores and up to 128 GB HBM3 memory
Post by: Redaktion on January 05, 2023, 16:35:30
The next gen Instinct MI300 chips will be AMD's first 3D stacked APU design integrating up to 24 Zen 4 EPYC cores combined with CDNA 3 GPGPU cores and on-die HBM3 memory for a total of more than 146 billion transistors.

https://www.notebookcheck.net/AMD-introduces-Instinct-MI300-exascale-APU-combining-Zen-4-EPYC-cores-with-CDNA-3-GPGPU-cores-and-up-to-128-GB-HBM3-memory.679242.0.html
Title: Re: AMD introduces Instinct MI300 exascale APU combining Zen 4 EPYC cores with CDNA 3 GPGPU cores an
Post by: gc on January 05, 2023, 19:54:53
substitute /same die/same package/

a die is made on a single 'chip' of silicon.

a multi-chip package may contain several dies from different fabs optimized for different purposes (logic, memory, device i/o, power, radio, sensors), interconnected more densely and energy-efficiently than on a printed ciruit board.

Title: Re: AMD introduces Instinct MI300 exascale APU combining Zen 4 EPYC cores with CDNA 3 GPGPU cores an
Post by: Bogdan Solca on January 05, 2023, 23:28:15
Quote from: gc on January 05, 2023, 19:54:53substitute /same die/same package/
My bad, fixed.
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