Multiple industry insiders and Twitter users have speculated that TSMC has run into several snags with its upcoming N3 process node. Hence, AMD may have to fabricate its Ryzen 8000 Zen 5 processors and Radeon RX 8000 RDNA 4 graphics cards on TSMC's 4 nm process.
https://www.notebookcheck.net/New-rumour-suggests-that-AMD-Zen-5-Ryzen-8000-processors-and-RDNA-4-graphics-card-are-unlikely-to-be-fabbed-on-TSMC-s-3-nm-node.602272.0.html
AMD always fighting the uphill battle against the rest though always making the big jumps that matter. Every year AMD just gets better and better so I dont think theres much to worry about.
Same thing for Apple A17, which may switch to either a revised N3 (N3B, N3E or N3P) or a N4/N4P node. I think TSMC made a mistake by staying on FinFet for it's "3nm" class node.
That being said, the mprovements in newer nodes are getting smaller and smaller (N4X being identical to N3 in some regards for example), so these aren't exactly big concerns.
Not to mention, Zen5 hasn't been taped out yet, so it's very unlikely this will mean a delay to it's launch (Q4 2023?)
As for RDNA4, this is the first time I hear it was intebded to be a N3 design (+ other nodes, as it's clearly a MCM/chiplet based architecture), so no idea what to make of that. Obviously it's not taped out either tho. ???
Pretty poor article once again, there is almost zero chance that either Zen 5 or RDNA 4 will release next year. They have plenty of time, so a bit early to start speculating.