Sd 8 gen 1+ and gen 2/ cooling soc, rumor cpu clock 3,2 and 3,4 ghz. Fab tsmc. Rumor fab tsmc 5nm rdna 3 and rtx 4000 series tdp 400 and 450 watt/ high 600 watt tdp.  (3nm gaafet good)

That's quite a big leap you take about Samsung fabrication being worse than Taiwan. The lower the die the more leaking can occur, electrons have less area to travel. Process alone doesn't justify a performance bump, the silicone has to be redesigned. The problem with Qualcomm (semiaccurate) is that they fired the people in they cpu team, nothing to do with Taiwan or Samsung. That has been old news, it was predicted that Qualcomm was not going to release a competitive product, especially the next generation. It's nothing new for Qualcomm, they screwed the sd810 among other chips.