they are spinning, the INTEL CPU being a nice heater has been a based meme for years
Quote from: notebookcheck.net/Intel-Core-Ultra-9-275HX-Processor-Benchmarks-and-Specs.943094.0.htmlThe Arrow Lake-HX chips are based on the desktop Arrow Lake-S chips and are composed of several chiplets. The CPU part is manufactured at TSMC in the modern N3B (3nm) process, the GPU also comes from TSMC in the N5P process. The SoC and I/O tile are manufactured in the TSMC N6 process. The base tile is manufactured by Intel in the 22nm process and carries the individual chiplets thanks to Fovero's 3D packaging.
Guess not even TSMC' power efficient node can help INTEL (now news tho).
Server providers [where power consumption matters] be like: Yep, we switching to AMD's Epyc.