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Posted by Redaktion
 - Yesterday at 08:11:51
imec and Ghent University have demonstrated 120 alternating silicon and silicon-germanium layers on 300mm wafers, a key step toward horizontally stacked 3D DRAM.

https://www.notebookcheck.net/Deposition-breakthrough-enables-the-development-of-120-layer-high-density-3D-DRAM.1096180.0.html