Quote from: Anonymousggg on March 23, 2021, 19:03:37
It's not about soldered memory. It's ultimately about putting RAM layers nanometers or microns away from a CPU layer. That will boost performance and power efficiency by orders of magnitude. Check out 3DSoC.
Even if they do this, you could still have a larger amount of RAM away from the CPU in a traditional DIMM form factor.
Surely that's nonsense. That would imply the CPU is idling at least 99 % of the time. That would give you two orders of magnitude improvement if you could remove idling completely. But even L1 cache has latency. That would imply a workload where very little work is done on any given chunk of data and which is probably jumping all over the place, defeating prefetching. Which probably indicates a poor software design. Although there are problems which are not cache friendly. And here is the rub. It's still going to be slower than L1 or L2 or even L3 (at least in the case of HBM). Those caches are on the die already. Presence of HBM won't make them any faster. Putting a limit on what improvement is achievable.
Yes, we've been trying to have as much memory as close to a processor as we can afford since forever. We're limited by technology. And there are applications where this is interesting. But big desktop computers are not the prime candidate. And I can't imagine the "orders of magnitude" increase. Even if I take it in the most modest meaning of two orders.