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English => News => Topic started by: Redaktion on May 29, 2019, 08:29:43

Title: Asus ROG G703 will use patent pending liquid metal thermal paste process, promises 13 C cooler temperatures
Post by: Redaktion on May 29, 2019, 08:29:43
Asus is ready to ship laptops with liquid metal thermal paste and the initial results have us excited. The cooler temperatures will lead directly to quieter, lighter, or thinner laptop designs from future ROG laptops.

https://www.notebookcheck.net/Asus-ROG-G703-will-use-patent-pending-liquid-metal-thermal-paste-process-promises-13-C-cooler-temperatures.422700.0.html
Title: Re: Asus ROG G703 will use patent pending liquid metal thermal paste process, promises 13 C cooler t
Post by: S.Yu on May 29, 2019, 11:32:47
This would only work if the bottleneck of the cooling system is the interface, not the fan power right?
Title: Re: Asus ROG G703 will use patent pending liquid metal thermal paste process, promises 13 C cooler t
Post by: J on May 29, 2019, 16:06:35
The brand is Thermal Grizzly. Conductonaut is the exact liquid metal being used. its even on the packaging. How did this make it past NBC's proof reading
Title: Re: Asus ROG G703 will use patent pending liquid metal thermal paste process, promises 13 C cooler t
Post by: Allen.Ngo on May 29, 2019, 18:56:42
Quote from: J on May 29, 2019, 16:06:35
The brand is Thermal Grizzly. Conductonaut is the exact liquid metal being used. its even on the packaging. How did this make it past NBC's proof reading

Our apologies, thank you for the correction :)