Print Page - Snapdragon 898 engineering sample promises 20% faster performance, but thermals continue to remain a problem

Title: Snapdragon 898 engineering sample promises 20% faster performance, but thermals continue to remain a problem
Post by: Redaktion on August 12, 2021, 11:03:22

Weibo leaker Digital Chat Station stumbled upon an early Qualcomm Snapdragon 898 engineering sample. It was 20% faster than its predecessor, but the chip ran quite hot. Qualcomm is expected to unveil the Snapdragon 898 sometime in December 2021.

https://www.notebookcheck.net/Snapdragon-898-engineering-sample-promises-20-faster-performance-but-thermals-continue-to-remain-a-problem.554876.0.html

Title: Re: Snapdragon 898 engineering sample promises 20% faster performance, but thermals continue to rema
Post by: 8&8 on August 12, 2021, 12:44:44

so has same perf of 888+ that is 20% faster than simple 888.

I repeat, those processors must be used for laptops or miniPcs than smarthphones. We must use others materials like carbons or photonic computing.

Title: Re: Snapdragon 898 engineering sample promises 20% faster performance, but thermals continue to rema
Post by: fsaddsdfsadas on August 12, 2021, 14:10:50

made on samsung process means hot...4nm samsung is barely 7nm tsmc. If it is even that.

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English => News => Topic started by: Redaktion on August 12, 2021, 11:03:22