According to a Careteks video, NVIDIA might be deploying a dual-sided PCB design, with a ray-tracing traversal coprocessor residing opposite the GPU die. This could potentially provide the RTX 3080 and RTX 30980 with a massive boost to ray-tracing capabilities.
https://www.notebookcheck.net/NVIDIA-Ampere-GeForce-RTX-3080-and-3090-could-feature-a-ray-tracing-traversal-coprocessor-better-ray-tracing-performance-than-PlayStation-5-Xbox-Series-X-and-Big-Navi.470737.0.html
This is interesting but then why A100 is a monolithic die?
I wonder how they can implement that on the mobile versions...
Quote from: dasdkas on June 15, 2020, 12:51:52
This is interesting but then why A100 is a monolithic die?
The A100 die does not feature RT cores, so this could be plausible considering this fact and this fact only.
Neverthless, with that being said, considering that a frame on Turing using RT and Tensor cores goes as follows: FLOAT --> RT CORE --> INT+FLOAT --> TENSOR CORE; it seems inefficient, that the RT part of the frame is offloaded, processed and then brought back again to run through the Tensor cores. Furthermore, a lot of gains will be achieved in the denoising part, meaning, using the Tensor cores.
But I'm no expert. So, maybe someone can add something to the discussion. I'm defnitely looking forward to what NVIDIA engineers come up with!
Pretty sure this will be only RTX 3090 specific feature.
Previously Nvidia called x90 only dual GPUs.
Then where would the heat go to?
As I see it here, there is no way ot dissipate heat from that coprocessor
Sounds like a huge drop in efficiency.
Quote from: Hyperus on June 16, 2020, 04:28:20
Then where would the heat go to?
As I see it here, there is no way ot dissipate heat from that coprocessor
Maybe because there is a fan on each side of the board if you looked..
Quote from: S.Yu on June 17, 2020, 01:06:09
Sounds like a huge drop in efficiency.
Why is that, a full die dedicated to rasterization.
Quote from: pete on June 18, 2020, 01:07:36
Quote from: Hyperus on June 16, 2020, 04:28:20
Then where would the heat go to?
As I see it here, there is no way ot dissipate heat from that coprocessor
Maybe because there is a fan on each side of the board if you looked..
Quote from: S.Yu on June 17, 2020, 01:06:09
Sounds like a huge drop in efficiency.
Why is that, a full die dedicated to rasterization.
Well, basically what mvl said.