Huawei's HiSilicon division signs a new agreement with a Chinese equipment-maker

[Redaktion]

HiSilicon is a group within Huawei responsible for the development of this OEM's in-house chipsets, the flagship Kirin mobile SoCs included. It has just signed a five-year deal with Shenzhen JT Automation Equipment, characterized as a collaboration on independent semiconductor processing. Therefore, the move could help Huawei circumvent the sanctions that prevent it working with US suppliers to help make its components.

https://www.notebookcheck.net/Huawei-s-HiSilicon-division-signs-a-new-agreement-with-a-Chinese-equipment-maker.549501.0.html