Intel detailed a few tidbits about its upcoming Meteor Lake, Arrow Lake, and Lunar Lake offerings at Hot Chips 34. The company also showed the architecture of a 6P+8E Meteor Lake part with separate CPU, GPU, I/O, and SoC tiles all packaged together using Foveros 3D packaging technology. Intel Graphics Compiler patches also suggest that Meteor Lake's tGPU may support hardware-accelerated ray tracing.https://www.notebookcheck.net/Intel-highlights-Foveros-3D-packaging-tech-coming-to-Meteor-Lake-Arrow-Lake-and-Lunar-Lake-Code-patches-suggest-Meteor-Lake-s-tGPU-supports-hardware-based-ray-tracing.641738.0.html
Intel the laggard. Still not able to mass produce 10nm chips. Has to rely on TSMC/Samsung to make 10nm/7nm/5nm/3nm chips. Too bad also laggard in 3D stacking technology. US sanctions on Huawei chipmaking forced them to develop 3D stacking of older nodes. Unfortunately (or fortunately) Huawei now also the leader of 3D stacking as is already the leader of 5G. Intel woefully behind everyone now because of years of monopoly and complacency!!
Quote from: Hunter2020 on August 24, 2022, 21:25:25Intel the laggard. Still not able to mass produce 10nm chips. Has to rely on TSMC/Samsung to make 10nm/7nm/5nm/3nm chips. Too bad also laggard in 3D stacking technology. US sanctions on Huawei chipmaking forced them to develop 3D stacking of older nodes. Unfortunately (or fortunately) Huawei now also the leader of 3D stacking as is already the leader of 5G. Intel woefully behind everyone now because of years of monopoly and complacency!!
Ok wumao
We need this packaging for desktop cpus, direct die like that, for 300W+