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AMD introduces Instinct MI300 exascale APU combining Zen 4 EPYC cores with CDNA 3 GPGPU cores and up to 128 GB HBM3 memory

Started by Redaktion, January 05, 2023, 16:35:30

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Redaktion


gc

substitute /same die/same package/

a die is made on a single 'chip' of silicon.

a multi-chip package may contain several dies from different fabs optimized for different purposes (logic, memory, device i/o, power, radio, sensors), interconnected more densely and energy-efficiently than on a printed ciruit board.



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